RDS Electronics- TEC1-12705 TEC1-12706 TEC1-12710 TEC1-12715 TEC1-12709 TEC1-12703 TEC1-12704 Thermoelectric Cooler Peltier

Product Description

TEC1-12706 12706 TEC Thermoelectric Cooler Peltier

 
Chip Type: TEC1-12706
 
External dimensions: 40 * 40 * 3.75mm
Internal resistance: 2.1 ~ 2.4Ω (ambient temperature of 23 ± 1 'C, 1kHZ Ac test)
The maximum temperature difference:  Tmax (Qc = 0) above 59 'C.
Working current: Imax = 4.3-4.6A (rated at 12V)
Rated voltage: 12V (Vmax: 15V starting current 5.8A)
Cooling power: Qcmax 55W
Working environment: temperature range -55 'C ~ 83'C (high ambient temperature drop directly affect the cooling efficiency)

TEC1-12703 30*30 12V3A

Model:TEC1-12703

Rated voltage:12V

Rated current:3A

Cooling capacity:21.6W

Maximum temperature difference:65 °

Dimensions:30 * 30 * 3.2

Positive and negative:Red positive, black negative

TEC1-12704 40*40 12V4A

Chip type: TEC1-12704
Overall dimensions: 40*40*4.0mm element 127
Wire specification: lead length 300 + 5mm RV standard wire single head 5mm tin plating
Internal resistance: 3.0~3.3 ohm (ambient temperature 23 - 1 DEG C, 1kHZ Ac)
Maximum temperature: Tmax (Qc=0) 63 DEG C.
Working current: Imax=4A (rated voltage)
Rated voltage: DC12V (Vmax:15.5V)
Cooling power: Qcmax 36W
Assembly pressure: 85N/cm2
Working environment: temperature range -55 DEG C to 83 C (high ambient temperature will directly affect the efficiency of refrigeration)
Packaging: Standard 704 silicone rubber seal
Packaging standard: foam box packaging, storage conditions ambient temperature -10 C ~ 40 C
Storage conditions: -40~60

TEC1-12705 40*40mm

Overall dimensions: 40*40*3.5mm component Logarithm 127 pairs

Wire specification: lead long 300±8mm RV standard conductor single head 5mm tin plating

Internal resistance: 1.4~1.5ω (ambient temperature 23±1°, 1kHZ AC test)

Maximum temperature difference: 62 ° above

Working current: imax=7.1A (max voltage. 5V start 9A)

Rated Voltage: $literal (maximum voltage: 5V)

Cooling power: 86W (high cooling surface temperature will reduce cooling power)

Assembling pressure: 85n/cm2

Working environment: Temperature range -55°~83° (high ambient temperature will directly affect refrigeration efficiency)

Packaging process: Ambient standard 704 Silicone rubber seal

Packaging standards: Foam box packaging, storage conditions ambient temperature -10°~40°

Storage conditions:-40~60°

Power Requirements: Single voltage 12V, current 9A above the working power supply (series and parallel use)

Device characteristics: Red line positive, black line negative (there is literally refrigeration surface, no literal heat dissipation surface)

• TEC1-12715 40*40mm

  Chip Model: TEC1-12715

SP1848-27145 40*40mm 120 degree