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Gap-filling thermal compound has glass bead option

2020-05-21 Editor:Super administratorSource:Original


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Called SilCool TIA241GF, it offers tacky adhesion and retained softness after cure for applications where movements in x, y, and z directions occur due to vibration, thermal cycling stress and thermal mismatch. Flame retarding is UL94V-0 equivalent.It is a two-part material (1:1 weight mix ratio) with non-slumping pasty consistency that can be used as liquid-dispensed alternative to pre-fabricated thermal pads, and there are 180 and 250µm glass bead option for bond thickness control. Vertical gaps up to 4mm can be bridged.

Source: This news is taken from www.electronicsweekly.com


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